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Thermal and Power Management of Integrated Circuits

Part of the Series on Integrated Circuits and Systems Book Series

DOI: 10.1007/0-387-29749-9

ISBN: 978-0-387-25762-4

Publisher: Springer US - Springer Journals

Jan 1, 2006

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Chapter 1Introduction

Pages: 1 –12

[The drive for higher performance has led to grater integration and higher clock frequency of integrated circuit chips in general and microprocessor chips in particular. This translates to higher power consumption and consequently higher heat dissipation and higher junction temperature. This...
LitStream

Chapter 2Power, Junction Temperature, and Reliability

Pages: 13 –49

[In this chapter, we initially discuss the power consumption trends and its impact on junction temperature elevation. Junction temperature plays a pivotal role in determining long term integrated circuit reliability. Therefore, we discuss the impact of junction temperature on the reliability of...
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Chapter 3Burn-in as a Reliability Screening Test

Pages: 51 –82

[Burn-in as a reliability screening test is one of the most important tests to ensure the quality and reliability of products under normal operating conditions. In this chapter subtle aspects of burn-in test are described and the junction temperature trends with scaling under burn-in condition...
LitStream

Chapter 4Thermal and Electrothermal Modeling

Pages: 83 –118

[In this chapter we begin with an overview of thermal modeling of high performance microprocessors with emphasis on the necessity of these models to ensure a reliable system. Later in this chapter we review the concept of the electro-thermal modeling and describe several approaches to...
LitStream

Chapter 5Thermal Runaway and Thermal Management

Pages: 119 –148

[This chapter begins with the concept of the thermal runaway and optimization methods to prevent the thermal runaway during reliability screening test (burn-in). Then we review the thermal management of the VLSI circuits during normal operating conditions to prevent thermal runaway and finally...
LitStream

Chapter 6Low Temperature CMOS Operation

Pages: 149 –175

[Low temperature operation with utilization of refrigeration as cooling electronic devices. In this chapter we review the low operation of the system has shown improvement in performance and the reliability of CMOS devices and describe different cooling solution for low temperature operation.]

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