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CHAPTER 2 Thick-Electrode DEP for Single-Cell 3D Rotation 2.1 INTRODUCTION At present, most of the DEP chips are based on 2D planar electrodes, which have problems such as fast electric field attenuation and small working distance. To solve the limitations, thick electrodes have been widely used in microfluidics in recent years because of its large working areas and uni- formity of electric field in the vertical direction [148, 149]. With the development of MEMS technology, researchers have proposed a variety of thick-electrode microfluidic chips with different functions. For example, in cell-sorting applica- tions, Wang et al. [150] designed a thick-electrode microfluidic chip to achieve cell sorting ( Figure 2.1(a)). The thick electrodes are deposited on the SU-8 microstructure by electrodeposition, but the fabrication is complicated, time-consuming, and costly. Li et al. used a method of heating low-melt- ing metal microspheres in a microchannel to make thick electrodes and used them for cell sorting [151]. However, this method has insufficient processing precision, and the shape of the metal after melting is less controllable, and it is easy to overflow the flow channel. Thick-electrode DEP has also been used for particle separation. For example, Kang et al. designed a 3D embedded
Published: Jan 1, 2020
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