Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

A Guide to Lead-free SoldersIntermetallic Formation and Growth

A Guide to Lead-free Solders: Intermetallic Formation and Growth Chapter 5 Dongil Kwon Intermetallic compounds (IMCs) comprise an important and integral part of the solder-joint structure. As we discussed in Chapter 4, IMCs in SnAg and SnAgCu systems are secondary phases of the microstructure of the solder joint and the size and dispersion affect the joint properties. During reactive wetting, IMCs will form layered structures between the molten solder and wetted sub- strate. This affects the local composition of the joint near the wetted surfaces. Depending upon the size and type of joint, the mechanical properties can in turn be influenced. Further, the high homologous temperature of solders sig- nificantly impacts diffusion-based processes in solder joints in service. Hence, in addition to microstructural coarsening, we can expect that intermetallic compounds, initially formed during reactive wetting, will develop further. This can potentially affect the microstructure, subsequent wetting behavior of sub- strates, and mechanical properties of joints. An understanding of the charac- teristics of IMCs and their development is an important part of understanding solder-joint behavior, particularly with changes in alloys in an environment of ever-decreasing solder-joint size. 5.1 Characteristics of Intermetallic Compounds We began our discussion of intermetallic compounds with a survey of the characteristics of the types of http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png

A Guide to Lead-free SoldersIntermetallic Formation and Growth

Editors: Engelmaier, Werner
Kwon, Dongil
A Guide to Lead-free Solders — Jan 1, 2007
Download PDF
29 pages

Loading next page...
 
/lp/springer-journals/a-guide-to-lead-free-solders-intermetallic-formation-and-growth-0CZfUUDeEB
Publisher
Springer London
Copyright
© Springer-Verlag London Limited 2007
ISBN
978-1-84628-309-3
Pages
97 –126
DOI
10.1007/978-1-84628-310-9_5
Publisher site
See Chapter on Publisher Site

Abstract

Chapter 5 Dongil Kwon Intermetallic compounds (IMCs) comprise an important and integral part of the solder-joint structure. As we discussed in Chapter 4, IMCs in SnAg and SnAgCu systems are secondary phases of the microstructure of the solder joint and the size and dispersion affect the joint properties. During reactive wetting, IMCs will form layered structures between the molten solder and wetted sub- strate. This affects the local composition of the joint near the wetted surfaces. Depending upon the size and type of joint, the mechanical properties can in turn be influenced. Further, the high homologous temperature of solders sig- nificantly impacts diffusion-based processes in solder joints in service. Hence, in addition to microstructural coarsening, we can expect that intermetallic compounds, initially formed during reactive wetting, will develop further. This can potentially affect the microstructure, subsequent wetting behavior of sub- strates, and mechanical properties of joints. An understanding of the charac- teristics of IMCs and their development is an important part of understanding solder-joint behavior, particularly with changes in alloys in an environment of ever-decreasing solder-joint size. 5.1 Characteristics of Intermetallic Compounds We began our discussion of intermetallic compounds with a survey of the characteristics of the types of

Published: Jan 1, 2007

Keywords: Intermetallic Compound; Solder Joint; Solder Alloy; Intermetallic Layer; Composite Solder

There are no references for this article.