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A Guide to Lead-free SoldersProduct Assurance

A Guide to Lead-free Solders: Product Assurance Chapter 8 Jillian Y. Evans 8.1 Environment Assemblies employing Pb-free solders can be reliably used for many applica- tions. However, environment and reliability must be carefully considered early in the development of the product in the changing technology environment we have described in Chapter 1. Consideration must be given to the three keys to success- ful SMT development: design, process and testing (Evans and Engelmaier 1990). These keys must interact, as shown in Figure 8.1, to develop a reliable product. Figure 8.1. Interaction of key activities for producing a reliable PWB assembly. Reprinted by permis- sions of the authors. 188 8 Product Assurance Table 8.1. Field use environments (IPC-SM-785). Reprinted with permission of IPC. Use category Worst case use environments for products in the field (IPC-SM-785) Minimum Maximum Typical cyclic Cyclic Cycles/ Approx. extreme extreme temperature hold year service temperature temperature swings time life (°C) (°C) (°C) (h) (y) Consumer 0 +60 35 12 365 1 3 electronics Computers +15 +60 20 2 1450 5 Telecomm 40 +85 35 12 365 7 20 Commercial 55 +95 20 2 3000 10 aircraft Automotive 55 +125 60 1 1000 5 underhood 100 1 300 140 2 40 Automotive 55 +65 30 http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png

A Guide to Lead-free SoldersProduct Assurance

Editors: Engelmaier, Werner
Evans, Jillian Y.
A Guide to Lead-free Solders — Jan 1, 2007
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Publisher
Springer London
Copyright
© Springer-Verlag London Limited 2007
ISBN
978-1-84628-309-3
Pages
187 –202
DOI
10.1007/978-1-84628-310-9_8
Publisher site
See Chapter on Publisher Site

Abstract

Chapter 8 Jillian Y. Evans 8.1 Environment Assemblies employing Pb-free solders can be reliably used for many applica- tions. However, environment and reliability must be carefully considered early in the development of the product in the changing technology environment we have described in Chapter 1. Consideration must be given to the three keys to success- ful SMT development: design, process and testing (Evans and Engelmaier 1990). These keys must interact, as shown in Figure 8.1, to develop a reliable product. Figure 8.1. Interaction of key activities for producing a reliable PWB assembly. Reprinted by permis- sions of the authors. 188 8 Product Assurance Table 8.1. Field use environments (IPC-SM-785). Reprinted with permission of IPC. Use category Worst case use environments for products in the field (IPC-SM-785) Minimum Maximum Typical cyclic Cyclic Cycles/ Approx. extreme extreme temperature hold year service temperature temperature swings time life (°C) (°C) (°C) (h) (y) Consumer 0 +60 35 12 365 1 3 electronics Computers +15 +60 20 2 1450 5 Telecomm 40 +85 35 12 365 7 20 Commercial 55 +95 20 2 3000 10 aircraft Automotive 55 +125 60 1 1000 5 underhood 100 1 300 140 2 40 Automotive 55 +65 30

Published: Jan 1, 2007

Keywords: Solder Joint; Power Dissipation; SnPb Solder; Surface Mount Technology; Temperature Swing

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