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A Guide to Lead-free SoldersThermomechanical Fatigue

A Guide to Lead-free Solders: Thermomechanical Fatigue Chapter 7 In Chapter 6, we discussed the mechanical properties of solders, focusing on examples of Pb-free alloys and their behavior. We now build on this information to understand the process of fatigue in solder joints. Fatigue in solder alloys is a complex process of interaction between fatigue mechanisms driven by plastic deformation and creep deformation that occur during cyclic loading of the sol- der joints. This complex damage process is called creep fatigue. Invariably, electronic equipment placed in service will be subject to cyclic loads; the severity of this loading is a major factor in deciding the ultimate life- time of the product. Analysis and testing must determine if the assembly will meet its life target, as decided by competitive market factors and/or field service requirements. For the most part, electronic equipment experiences cyclic load- ing from changing temperatures in the environment or due to dissipation of power from operating the product or equipment. Temperature changes then result in cyclic loading of the solder joints, which attach the components to the printed wiring boards. We will discuss solder-joint fatigue from a generic perspective. Examples are presented for both Pb-free solders and from our knowledge base of SnPb near- http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png

A Guide to Lead-free SoldersThermomechanical Fatigue

Editors: Engelmaier, Werner
A Guide to Lead-free Solders — Jan 1, 2007
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Publisher
Springer London
Copyright
© Springer-Verlag London Limited 2007
ISBN
978-1-84628-309-3
Pages
145 –185
DOI
10.1007/978-1-84628-310-9_7
Publisher site
See Chapter on Publisher Site

Abstract

Chapter 7 In Chapter 6, we discussed the mechanical properties of solders, focusing on examples of Pb-free alloys and their behavior. We now build on this information to understand the process of fatigue in solder joints. Fatigue in solder alloys is a complex process of interaction between fatigue mechanisms driven by plastic deformation and creep deformation that occur during cyclic loading of the sol- der joints. This complex damage process is called creep fatigue. Invariably, electronic equipment placed in service will be subject to cyclic loads; the severity of this loading is a major factor in deciding the ultimate life- time of the product. Analysis and testing must determine if the assembly will meet its life target, as decided by competitive market factors and/or field service requirements. For the most part, electronic equipment experiences cyclic load- ing from changing temperatures in the environment or due to dissipation of power from operating the product or equipment. Temperature changes then result in cyclic loading of the solder joints, which attach the components to the printed wiring boards. We will discuss solder-joint fatigue from a generic perspective. Examples are presented for both Pb-free solders and from our knowledge base of SnPb near-

Published: Jan 1, 2007

Keywords: Fatigue Life; Solder Joint; Solder Alloy; Strain Range; Ball Grid Array

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