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A Practical Approach to VLSI System on Chip (SoC) DesignSoC Packaging

A Practical Approach to VLSI System on Chip (SoC) Design: SoC Packaging [This chapter deals with trends in SOC package designs, packaging processes, types, architectures, criteria for the selection of packages, and their performance. It also discusses left shift design support needed for efficient packaging in SOC designs. It introduces the concept of 3D IC designs.] http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png

A Practical Approach to VLSI System on Chip (SoC) DesignSoC Packaging

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Publisher
Springer International Publishing
Copyright
© The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerland AG 2022
ISBN
978-3-031-18362-1
Pages
215 –228
DOI
10.1007/978-3-031-18363-8_10
Publisher site
See Chapter on Publisher Site

Abstract

[This chapter deals with trends in SOC package designs, packaging processes, types, architectures, criteria for the selection of packages, and their performance. It also discusses left shift design support needed for efficient packaging in SOC designs. It introduces the concept of 3D IC designs.]

Published: Dec 14, 2022

Keywords: Packaging; Plastic package; LQFP; QFN; BGA; Ceramic package; MIL; Commercial; Space; Industry standard; Flip-chip package; Bond-ability; Wire bonding

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